By R. E. Honig (auth.), Professor Dr. Alfred Benninghoven, Dr. Richard J. Colton, Dr. David S. Simons, Dr. Helmut W. Werner (eds.)
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Additional info for Secondary Ion Mass Spectrometry SIMS V: Proceedings of the Fifth International Conference, Washington, DC, September 30 – October 4, 1985
Example text
By taking OKAJIMA's data into account together with ours, it is concluded that the sputtering process of pure metals under oxygen ion bombardment can be simply explained in terms of the classical atomic collision model, irrespective of the chemical nature of the primary ions. On the other hand, the total sputtering yields Y of Ti-Al [16] and Cu-Al [17] alloy films as a function of Al concentration are shown in figure 1. The broken lines in the figure indicate the straight lines connecting sputtering yields of Al and Ti and Al and Cu.
Recently, OKAJIMA [18] measured the sputtering yield of several metals under Ar+ bombardment and showed a linear plot on a log-log scale between the sputtering yield and the cohesive energy of the target materials. By taking OKAJIMA's data into account together with ours, it is concluded that the sputtering process of pure metals under oxygen ion bombardment can be simply explained in terms of the classical atomic collision model, irrespective of the chemical nature of the primary ions. On the other hand, the total sputtering yields Y of Ti-Al [16] and Cu-Al [17] alloy films as a function of Al concentration are shown in figure 1.
R. J. Conzeiiifus, J. M. Capellen: Int. J. Mass Spectrom. Ion Phys. 34, 197 (1980) 84. R. J. Conzemius, D. S. Simons, Z. Shankai, G. D. Byrd: in Proc. 18th Ann. Conf. Mi c robeam Ana 1. Soc. 1983, p. 301 85. B. Lindner, U. Seydel: Anal. Chem. 57,895 (1985) 86. M. B. Comisarow, A. G. Marshall: Chem. Phys. Letters 25, 282 (1974); J. Chem. Phys. 64, 110 (1976) 87. A. G. Marshall :-Acc. Chem. , submitted (1985) 88. R. B. Cody, R. C. Burnier, W. D. , T. J. Carlin, D. A. McCrery, R. K. Lengel, B. S. Freiser: Int.
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